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Projects and Research Interests

• Soft Matter
• Polymer Network
• Polymer nanocomposites
• Coarse-grained Modeling

Short C.V.

• 3/2024 - present: Universität des Saarlandes (Saarbrücken), group of Prof. Heiko Rieger, Post. Doc. position.
• 6/2022 - 12/2023: University of Groningen (Netherlands), Faculty of Science and Engineering, directed by Andrea Giuntoli, visiting PhD Student.
• 6/2019 - 12/2023: University of Science and Technology Beijing (Beijing, China), supervised by Kangmin Niu, PhD Student.

Publications

Z. Li, Y. Wang, G. Ma, Y. Liao, X. Gu, and W. Xia, Probing conformational properties of conjugated polymers in dilute solutions under variable solvent quality via coarse-grained modeling, J. Polym. Sci. 62, 1296 (2024).

Z. Li, Y. Wang, A. Alesadi, L.A. Ruiz Pestana, W. Xia, Particle-based mesoscale modeling and coarse-graining methods, Fundamentals of Multiscale Modeling of Structural Materials, Elsevier, 75-111 (2023).

Y. Wang, Z. Li, D. Sun, N. Jiang, K. Niu, A. Giuntoli, and W. Xia, Understanding the thermomechanical behavior of graphene-reinforced conjugated polymer nanocomposite via coarse-grained modeling, Nanoscale 15, 17124-17137 (2023).

Y. Wang, W. Nie, L. Wang, D. Zhang, K. Niu, and W. Xia, Understanding the graphene polymer interfacial mechanical behavior via coarse-grained modeling, Computational Materials Science 222, 112109 (2023).

Y. Wang, Z. Li, K. Niu, and W. Xia, Energy Renormalization for Coarse-Graining of Thermomechanical Behaviors of Conjugated Polymer, Polymer 256, 125159 (2022).

Y. Wang, K. Niu, L. Wang, and W. Xia, A Molecular Dynamics Study of Mechanical Properties of Bioinspired Functionally Graded Cu-Ni Alloy, Molecular Simulation 256, 125159 (2022).

Y. Wang, K. Niu, and Y. Wu, Multiscale modelling of graphene sheet and its application in laminated composites, Composite Structures 276, 114416 (2021).

Y. Wang, J. Zuo, N. Jiang, K. Niu, and Y. Wu, Uniaxial tension deformation study of copper/nickel laminated composites: Effects of lamella number and interlamellar spacing, Computational Materials Science 171, 109272 (2020).

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